CZ

Soldering & SMT

Practical training in soldering and surface mounting, intended for production technicians. The goal is to acquire fundamentals and gain practical skill in soldering and mechanical operations in electrotechnics. Courses take place at our facility; by agreement, we can run a course at the customer's site. The schedule is typically theory in the morning, practice in the afternoon — adjustable on request.

The courses suit both technical-secondary-school students and experienced professionals, and serve for requalification, upskilling, or onboarding new staff. A course can also be taught in English, and partly in Russian. Theory is delivered by university lecturers. The minimum number of participants is 4. A training manual is supplied on request.

Courses are usually offered at three difficulty levels — BASIC, MEDIUM and HIGH.

Lectures

Theoretical part: two-day course 2× 3 h, one-day 1× 3 h. A combination of the following topics can be selected.

  • Function and construction of electronic components — classical (PTH) and SMD packages.
  • Design and construction of classical (PTH) components.
  • Design and construction of SMD packages.
  • Handling of components, including antistatic protection.
  • Antistatic workplace requirements and the principles of working with ESD- and moisture-sensitive components.
  • New designs in electronics and microelectronics.
  • PCB layout topology, including the differences between design for wave and reflow soldering.
  • Introduction to PCB manufacturing and currently used technologies.
  • Surface finishes and choosing them for solderability and reliability.
  • Assembly, soldering and inspection processes — including fluxes and cleaning agents.
  • Reliability of the solder joint.

Workstations and skills

Practical part: two-day course 2× 4 h, one-day 1× 4 h.

  • Manual soldering and repair of through-hole (PTH) designs — cables and connectors, electronic desoldering, bottom preheating and mini-wave.
  • SMT soldering and rework of surface-mount parts — chip packages down to 0402, cylindrical packages, Flat-Pack and others.
  • Option to run the course on your own printed circuit boards.
  • Hands-on contact technology and hot-air soldering.
  • QFN and BGA soldering training.
  • Solving a specific problem from your production during the course.
  • Repair of solder pads on printed circuit boards.
  • BGA package repair — reballing.
  • Optional excursion through SMTplus production.

Each two-day-course participant assembles a simple board by hand-soldering as proof of skill. Every participant receives feedback and a certificate of completion.

Workplace equipment

Each pair of participants has at least the following on a workbench fitted with an anti-static mat:

  • temperature-controlled PACE soldering station, soldering handpiece with two tips (small and large mini-wave), electronic desoldering tool and soldering tweezers with chip-component tips;
  • a tip set for contact and contactless component removal/placement;
  • hand tools, a watchmaker's loupe and solder wick;
  • a tray with various package types;
  • cored solder wire (standard SAC305 and SN100C) and paste flux in a dedicated applicator (No Clean);
  • a test soldering board for package-soldering training;
  • cleaning agents.

For all participants: electronic and manual desoldering tools with suction tips, hot-air desoldering / soldering rework, and inspection equipment for visual joint control.

Standards

All theoretical and practical training is conducted in line with the relevant European and Czech ČSN EN and American IPC standards.

Course materials

From the courses

From the course
From the course
From the course
From the course

Register interest — soldering / SMT

Let us know your preferred level, language and approximate date. We confirm dates once the group is filled (minimum 4 participants).

Customers

Flextronics Barco SPŠ Písek Panasonic Andrew Telecommunications Elcom Kampos AŽD Symbol Technologies TAM Europe JJS Electronics Honeywell YSOFT Tyco Electronics EPCOS Šumperk STROM Telecom SIEMENS VDO Thermo Fischer Scientific Edwards Vacuum